Manufacturer’s Representative
Solving problems for the electronics & semiconductor industries in so. California since 1983
Photo Gallery
Design Engineering
Quality Assurance - Reliability - Failure Analysis
Production: Assembly, Test & Inspection
Production: Assembly, Test & Inspection
Quality Assurance - Reliability - Failure Analysis
Production: Assembly, Test & Inspection
Quality Assurance - Reliability - Failure Analysis
Quality Assurance - Reliability - Failure Analysis
Quality Assurance - Reliability - Failure Analysis
Products
NIKON METROLOGY X-rAY
MPI Corp. - Thermal Division
NIKON METROLOGY X-rAY
Real Time X-ray Systems:
Sub-micron feature recognition & Computed Tomography (CT) systems. Contract Lab Services.
http://www.nikonmetrology.com/products/xray_ct_inspection/
SONOSCAN
MPI Corp. - Thermal Division
NIKON METROLOGY X-rAY
Acoustic Microscopes
CSAM Systems for Nondestructive evaluation of any bond in electronic packaging & materials with ultrasound.
Also, Contract Lab Services.
MPI Corp. - Thermal Division
MPI Corp. - Thermal Division
CAMTEK USA – INTELLIGENT IMAGING
Thermal Air Systems - DC Inverter/Chiller! Half the Noise! and Half the Power Consumption of traditional AC thermal streams.
http://www.mpi-corporation.com/thermal-test/
CAMTEK USA – INTELLIGENT IMAGING
CAMTEK USA – INTELLIGENT IMAGING
CAMTEK USA – INTELLIGENT IMAGING
Automated Optical Inspection Systems for Wafers
High Speed Wafer Inspection of probe marks (post probe), diced die on film frame, 3D of bumped wafers + MEMS.
PINK ThermoSystems, GmBh
CAMTEK USA – INTELLIGENT IMAGING
PINK ThermoSystems, GmBh
Vacuum Soldering Systems – Both Solder Paste & Preform (using formic acid)
7 minute processing time, with <1% voiding.
http://www.pink.de/en/soldering-technology.html
ableprint Technology
CAMTEK USA – INTELLIGENT IMAGING
PINK ThermoSystems, GmBh
Pressure Curing Ovens
Unique combination of pressure & heat modulation to eliminate voiding in underfill during cure, on Flip Chip assemblies.
http://www.ableprint.com.tw/en/